Key Features and Specifications of SSMP Connectors
1. Compact Design
Approximately 30% smaller than SMP connectors.
Suitable for high-density installations and miniaturization of RF modules.
Ideal for board-to-board coupling in modular systems.
2. Electrical Performance
Characteristic impedance: 50 Ω, ensuring signal integrity.
Frequency range: DC to 50 GHz, supporting a wide range of applications from basic telecommunications to advanced radar systems.
Voltage rating: Approximately 170 V RMS.
Dielectric withstand voltage: Up to 500 V RMS.
Insulation resistance: ≥ 2000 MΩ.
VSWR (Voltage Standing Wave Ratio): Typically ≤ 1.25 up to 18 GHz, and ≤ 1.5 up to 50 GHz, indicating excellent signal reflection characteristics.
3. Mechanical Characteristics
Insertion force: Varies between 2.5 lbs (smooth bore) and 4.5 lbs (full detent), balancing ease of use with secure connection.
Pull-out force: Between 1.5 lbs and 6.5 lbs depending on the interface type.
Durability: Rated for up to 100 to 500 mating cycles, depending on the connector type.
Hermetic sealing: Available options with leakage rates ≤ 1.01325 x 10^-3 Pa·cm³/s, suitable for harsh environments.
4. Material Composition
Center conductors typically made from gold-plated beryllium bronze or phosphor bronze for excellent conductivity and corrosion resistance.
Outer shells and metal parts use stainless steel, kovar, or brass with gold plating to ensure durability.
Insulators made from glass sintering, PTFE, or PEI for optimal dielectric properties.
