Series SMP RF Coaxial Connector: Ultra-Miniature Blind-Mate High-Frequency Solution
Release time:2026-01-31
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Series SMP RF Coaxial Connector is an ultra-miniature, high-performance RF connecting component featuring a push-on/snap-on blind-mate design, compliant with MIL-STD-348 and IEC 61169-69 standards. As a core interconnection part for high-density, high-frequency systems, it balances compact size, excellent electrical performance and convenient operation, widely serving aerospace, radar, communication and test & measurement fields.
The series boasts superior electrical performance tailored for high-frequency scenarios. With a fixed characteristic impedance of 50Ω, it supports a working frequency range of DC to 40GHz (up to 65GHz for enhanced models), perfectly adapting to millimeter wave and high-speed signal transmission needs. Key parameters are outstanding: VSWR is ≤1.30 for straight types and ≤1.35 for right-angle types, contact resistance of inner conductor ≤6.0mΩ and outer conductor ≤2.0mΩ, insulation resistance ≥5000MΩ, ensuring minimal signal attenuation and distortion.
Its unique advantages lie in blind-mate capability and flexible detent systems. The blind-mate design allows tool-free connection without visual alignment, compensating for axial and radial misalignment to avoid PCB stress. It offers three detent options—full, limited and smooth bore—catering to different retention and plugging cycle needs, with smooth bore models supporting over 1000 mating cycles. Manufactured with precision processes, it adopts gold-plated beryllium copper contacts, stainless steel or brass housing and PTFE insulators, withstanding -65℃ to +165℃ and harsh conditions like vibration and salt fog.
Widely applied in high-density PCB board-to-board interconnections, miniaturized RF modules, satellite communication, radar systems and test instruments, it is paired with miniature flexible or semi-rigid cables. As equipment evolves towards miniaturization and high frequency, it remains a reliable, high-performance solution for ultra-compact RF interconnection, empowering the advancement of high-frequency technologies.